Polishing pad conditioning apparatus
A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit dis...
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| creator | Koo, Ja Eung Song, Hyeon Dong Hong, Jin Suk Jang, Young Seok Na, Jeong Min Ryu, Chang Gil Kim, Kuen Byul Lee, Eun Seok |
| description | A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11648644B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11648644B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11648644B23</originalsourceid><addsrcrecordid>eNrjZFAJyM_JLM7IzEtXKEhMUUjOz0vJLMnMzwMJJBYUJBYllpQW8zCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0MzEwszExMnI2Ni1AAAOUsnWw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polishing pad conditioning apparatus</title><source>esp@cenet</source><creator>Koo, Ja Eung ; Song, Hyeon Dong ; Hong, Jin Suk ; Jang, Young Seok ; Na, Jeong Min ; Ryu, Chang Gil ; Kim, Kuen Byul ; Lee, Eun Seok</creator><creatorcontrib>Koo, Ja Eung ; Song, Hyeon Dong ; Hong, Jin Suk ; Jang, Young Seok ; Na, Jeong Min ; Ryu, Chang Gil ; Kim, Kuen Byul ; Lee, Eun Seok</creatorcontrib><description>A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230516&DB=EPODOC&CC=US&NR=11648644B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230516&DB=EPODOC&CC=US&NR=11648644B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Koo, Ja Eung</creatorcontrib><creatorcontrib>Song, Hyeon Dong</creatorcontrib><creatorcontrib>Hong, Jin Suk</creatorcontrib><creatorcontrib>Jang, Young Seok</creatorcontrib><creatorcontrib>Na, Jeong Min</creatorcontrib><creatorcontrib>Ryu, Chang Gil</creatorcontrib><creatorcontrib>Kim, Kuen Byul</creatorcontrib><creatorcontrib>Lee, Eun Seok</creatorcontrib><title>Polishing pad conditioning apparatus</title><description>A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAJyM_JLM7IzEtXKEhMUUjOz0vJLMnMzwMJJBYUJBYllpQW8zCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0MzEwszExMnI2Ni1AAAOUsnWw</recordid><startdate>20230516</startdate><enddate>20230516</enddate><creator>Koo, Ja Eung</creator><creator>Song, Hyeon Dong</creator><creator>Hong, Jin Suk</creator><creator>Jang, Young Seok</creator><creator>Na, Jeong Min</creator><creator>Ryu, Chang Gil</creator><creator>Kim, Kuen Byul</creator><creator>Lee, Eun Seok</creator><scope>EVB</scope></search><sort><creationdate>20230516</creationdate><title>Polishing pad conditioning apparatus</title><author>Koo, Ja Eung ; Song, Hyeon Dong ; Hong, Jin Suk ; Jang, Young Seok ; Na, Jeong Min ; Ryu, Chang Gil ; Kim, Kuen Byul ; Lee, Eun Seok</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11648644B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Koo, Ja Eung</creatorcontrib><creatorcontrib>Song, Hyeon Dong</creatorcontrib><creatorcontrib>Hong, Jin Suk</creatorcontrib><creatorcontrib>Jang, Young Seok</creatorcontrib><creatorcontrib>Na, Jeong Min</creatorcontrib><creatorcontrib>Ryu, Chang Gil</creatorcontrib><creatorcontrib>Kim, Kuen Byul</creatorcontrib><creatorcontrib>Lee, Eun Seok</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Koo, Ja Eung</au><au>Song, Hyeon Dong</au><au>Hong, Jin Suk</au><au>Jang, Young Seok</au><au>Na, Jeong Min</au><au>Ryu, Chang Gil</au><au>Kim, Kuen Byul</au><au>Lee, Eun Seok</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing pad conditioning apparatus</title><date>2023-05-16</date><risdate>2023</risdate><abstract>A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | Polishing pad conditioning apparatus |
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