Vertical tunneling field effect transistor with dual liner bottom spacer

Embodiments of the present invention are directed to fabrication method and resulting structures for vertical tunneling field effect transistors (VFETs) having a dual liner bottom spacer. In a non-limiting embodiment of the invention, a first liner is formed on a top surface of a source or drain (S/...

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Bibliographische Detailangaben
Hauptverfasser: Bergendahl, Marc A, Teehan, Sean, Miller, Eric, Cheng, Kangguo, Sporre, John
Format: Patent
Sprache:eng
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