Silver/tin electroplating bath and method of using the same

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group c...

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Hauptverfasser: Chevalier, Jean W, Bellemare, Richard A, Ryl, Michael M, Xu, Fengting, Long, Ernest
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creator Chevalier, Jean W
Bellemare, Richard A
Ryl, Michael M
Xu, Fengting
Long, Ernest
description An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.
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subjects APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CURRENT COLLECTORS
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LINE CONNECTORS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Silver/tin electroplating bath and method of using the same
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