Memory cells and methods for forming memory cells

According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Hsieh, Curtis Chun-I, Yi, Wanbing, Jiang, Yi, Leong, Lup San, Tan, Juan Boon, Lin, Benfu
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Hsieh, Curtis Chun-I
Yi, Wanbing
Jiang, Yi
Leong, Lup San
Tan, Juan Boon
Lin, Benfu
description According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member has a first end and a second end opposite to the first end. The first end is disposed towards the transistor, and the second end is disposed towards the dielectric member. The contact member has a side surface extending from the first end to the second end. The second end may have a recessed end surface that has a section that slopes towards the side surface so as to form a tip with the side surface at the second end. The dielectric member may be disposed over the second end of the contact member and may include at least a portion disposed over the tip.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11641789B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11641789B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11641789B23</originalsourceid><addsrcrecordid>eNrjZDD0Tc3NL6pUSE7NySlWSMxLUchNLcnITylWSMsvAuHczLx0oBhCEQ8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstiQ8NNjQ0MzE0t7B0MjImRg0AjMgrzg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Memory cells and methods for forming memory cells</title><source>esp@cenet</source><creator>Hsieh, Curtis Chun-I ; Yi, Wanbing ; Jiang, Yi ; Leong, Lup San ; Tan, Juan Boon ; Lin, Benfu</creator><creatorcontrib>Hsieh, Curtis Chun-I ; Yi, Wanbing ; Jiang, Yi ; Leong, Lup San ; Tan, Juan Boon ; Lin, Benfu</creatorcontrib><description>According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member has a first end and a second end opposite to the first end. The first end is disposed towards the transistor, and the second end is disposed towards the dielectric member. The contact member has a side surface extending from the first end to the second end. The second end may have a recessed end surface that has a section that slopes towards the side surface so as to form a tip with the side surface at the second end. The dielectric member may be disposed over the second end of the contact member and may include at least a portion disposed over the tip.</description><language>eng</language><subject>ELECTRICITY</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230502&amp;DB=EPODOC&amp;CC=US&amp;NR=11641789B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230502&amp;DB=EPODOC&amp;CC=US&amp;NR=11641789B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hsieh, Curtis Chun-I</creatorcontrib><creatorcontrib>Yi, Wanbing</creatorcontrib><creatorcontrib>Jiang, Yi</creatorcontrib><creatorcontrib>Leong, Lup San</creatorcontrib><creatorcontrib>Tan, Juan Boon</creatorcontrib><creatorcontrib>Lin, Benfu</creatorcontrib><title>Memory cells and methods for forming memory cells</title><description>According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member has a first end and a second end opposite to the first end. The first end is disposed towards the transistor, and the second end is disposed towards the dielectric member. The contact member has a side surface extending from the first end to the second end. The second end may have a recessed end surface that has a section that slopes towards the side surface so as to form a tip with the side surface at the second end. The dielectric member may be disposed over the second end of the contact member and may include at least a portion disposed over the tip.</description><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD0Tc3NL6pUSE7NySlWSMxLUchNLcnITylWSMsvAuHczLx0oBhCEQ8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstiQ8NNjQ0MzE0t7B0MjImRg0AjMgrzg</recordid><startdate>20230502</startdate><enddate>20230502</enddate><creator>Hsieh, Curtis Chun-I</creator><creator>Yi, Wanbing</creator><creator>Jiang, Yi</creator><creator>Leong, Lup San</creator><creator>Tan, Juan Boon</creator><creator>Lin, Benfu</creator><scope>EVB</scope></search><sort><creationdate>20230502</creationdate><title>Memory cells and methods for forming memory cells</title><author>Hsieh, Curtis Chun-I ; Yi, Wanbing ; Jiang, Yi ; Leong, Lup San ; Tan, Juan Boon ; Lin, Benfu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11641789B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>Hsieh, Curtis Chun-I</creatorcontrib><creatorcontrib>Yi, Wanbing</creatorcontrib><creatorcontrib>Jiang, Yi</creatorcontrib><creatorcontrib>Leong, Lup San</creatorcontrib><creatorcontrib>Tan, Juan Boon</creatorcontrib><creatorcontrib>Lin, Benfu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hsieh, Curtis Chun-I</au><au>Yi, Wanbing</au><au>Jiang, Yi</au><au>Leong, Lup San</au><au>Tan, Juan Boon</au><au>Lin, Benfu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Memory cells and methods for forming memory cells</title><date>2023-05-02</date><risdate>2023</risdate><abstract>According to various embodiments, there is provided a memory cell. The memory cell may include a transistor, a dielectric member, an electrode and a contact member. The dielectric member may be disposed over the transistor. The electrode may be disposed over the dielectric member. The contact member has a first end and a second end opposite to the first end. The first end is disposed towards the transistor, and the second end is disposed towards the dielectric member. The contact member has a side surface extending from the first end to the second end. The second end may have a recessed end surface that has a section that slopes towards the side surface so as to form a tip with the side surface at the second end. The dielectric member may be disposed over the second end of the contact member and may include at least a portion disposed over the tip.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11641789B2
source esp@cenet
subjects ELECTRICITY
title Memory cells and methods for forming memory cells
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T14%3A46%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hsieh,%20Curtis%20Chun-I&rft.date=2023-05-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11641789B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true