Copper-alloy capping layers for metallization in touch-panel displays

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo,...

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Bibliographische Detailangaben
Hauptverfasser: Hogan, Patrick, Dary, Francois-Charles, Abouaf, Marc, Sun, Shuwei, Zhang, Qi
Format: Patent
Sprache:eng
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