Integrated circuit packages to minimize stress on a semiconductor die
An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due...
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| creator | Stenson, Bernard Fitzgerald, Padraig Liam Flynn, Michael John Lakshmanan, Ramji Sitaraman Twohig, Michael James Kierse, Oliver O'Sullivan, Laurence Brendan |
| description | An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Integrated circuit packages to minimize stress on a semiconductor die |
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