Methods and systems for product failure prediction based on X-ray image re-examination
In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Adler, David Lewis Jewler, Scott Joseph Chrissan, Douglas A |
| description | In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11615533B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11615533B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11615533B23</originalsourceid><addsrcrecordid>eNqNij0KwkAUBtNYiHqH5wG2iEs8gKLYWPmDXXhmv8SF7A_7NmBubwQPYDUzMPPifkZ-BSPE3pCMkuGE2pAopmCGJlPLth8SpoaxTbbB05MFhiZ5qMQjWccdKEHhzc56_j7LYtZyL1j9uCjWx8N1f1KIoYZEbuCR69ulLLdlVWm92-h_ng8XYzmU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Methods and systems for product failure prediction based on X-ray image re-examination</title><source>esp@cenet</source><creator>Adler, David Lewis ; Jewler, Scott Joseph ; Chrissan, Douglas A</creator><creatorcontrib>Adler, David Lewis ; Jewler, Scott Joseph ; Chrissan, Douglas A</creatorcontrib><description>In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASUREMENT OF NUCLEAR OR X-RADIATION ; MEASURING ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230328&DB=EPODOC&CC=US&NR=11615533B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230328&DB=EPODOC&CC=US&NR=11615533B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Adler, David Lewis</creatorcontrib><creatorcontrib>Jewler, Scott Joseph</creatorcontrib><creatorcontrib>Chrissan, Douglas A</creatorcontrib><title>Methods and systems for product failure prediction based on X-ray image re-examination</title><description>In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASUREMENT OF NUCLEAR OR X-RADIATION</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNij0KwkAUBtNYiHqH5wG2iEs8gKLYWPmDXXhmv8SF7A_7NmBubwQPYDUzMPPifkZ-BSPE3pCMkuGE2pAopmCGJlPLth8SpoaxTbbB05MFhiZ5qMQjWccdKEHhzc56_j7LYtZyL1j9uCjWx8N1f1KIoYZEbuCR69ulLLdlVWm92-h_ng8XYzmU</recordid><startdate>20230328</startdate><enddate>20230328</enddate><creator>Adler, David Lewis</creator><creator>Jewler, Scott Joseph</creator><creator>Chrissan, Douglas A</creator><scope>EVB</scope></search><sort><creationdate>20230328</creationdate><title>Methods and systems for product failure prediction based on X-ray image re-examination</title><author>Adler, David Lewis ; Jewler, Scott Joseph ; Chrissan, Douglas A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11615533B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASUREMENT OF NUCLEAR OR X-RADIATION</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Adler, David Lewis</creatorcontrib><creatorcontrib>Jewler, Scott Joseph</creatorcontrib><creatorcontrib>Chrissan, Douglas A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Adler, David Lewis</au><au>Jewler, Scott Joseph</au><au>Chrissan, Douglas A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods and systems for product failure prediction based on X-ray image re-examination</title><date>2023-03-28</date><risdate>2023</risdate><abstract>In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US11615533B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASUREMENT OF NUCLEAR OR X-RADIATION MEASURING PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING |
| title | Methods and systems for product failure prediction based on X-ray image re-examination |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T14%3A19%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Adler,%20David%20Lewis&rft.date=2023-03-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11615533B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |