Method of manufacturing an electronic device and electronic device manufactured thereby

Method of manufacturing an electronic device and electronic device manufactured thereby

Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby...

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Hauptverfasser: Chung, Ji Young, Lim, Kwangmo Chris, Kim, Hwan Kyu, Hwang, Tae Kyeong, Kim, Dae Gon
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Chung, Ji Young
Lim, Kwangmo Chris
Kim, Hwan Kyu
Hwang, Tae Kyeong
Kim, Dae Gon
description Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of manufacturing an electronic device and electronic device manufactured thereby
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