Method of manufacturing an electronic device and electronic device manufactured thereby

Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby...

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Bibliographische Detailangaben
Hauptverfasser: Chung, Ji Young, Lim, Kwangmo Chris, Kim, Hwan Kyu, Hwang, Tae Kyeong, Kim, Dae Gon
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.