Thermal switch for rapid thermal coupling and decoupling of devices under test

An apparatus for testing integrated circuits (ICs) , includes a first thermal contact structure having a first surface to interface with a heat source and an opposing second surface to interface with a device under test (DUT). A second thermal contact structure is above the first thermal contact str...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hastings, James, Jensen, Morten, Coons, Todd, Walczyk, Joe F
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!