Package and method of fabricating the same

Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A componen...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liu, Tzuan-Horng, Shih, Chao-Wen, Hu, Jen-Li, Chen, Ming-Fa
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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