Package and method of fabricating the same

Package and method of fabricating the same

Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A componen...

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Hauptverfasser: Liu, Tzuan-Horng, Shih, Chao-Wen, Hu, Jen-Li, Chen, Ming-Fa
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Liu, Tzuan-Horng
Shih, Chao-Wen
Hu, Jen-Li
Chen, Ming-Fa
description Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A component is formed in the bonding structure. The component includes a passive device or a transmission line. The method further includes forming a first and a second electrical connectors electrically coupling to a first end and a second end of the component.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Package and method of fabricating the same
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