Integrated electronic device with a redistribution region and a high resilience to mechanical stresses and method for its preparation

A method of manufacturing an integrated electronic device including a semiconductor body and a passivation structure including a frontal dielectric layer bounded by a frontal surface. A hole is formed extending into the frontal surface and through the frontal dielectric layer. A conductive region is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Pipia, Francesco Maria, Venegoni, Ivan, Votta, Annamaria, Milanesi, Francesca, Colpani, Paolo, Sciarrillo, Samuele
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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