Methods and apparatus for processing a substrate

Methods and apparatus for processing a substrate are provided herein. For example, the method can include depositing a first layer of metal on a first substrate; depositing a second layer of metal atop the first layer of metal; depositing a third layer of metal on a second substrate; depositing a fo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wada, Yuichi, Hsiung, Chien-Kang, Mori, Glen T
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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