Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor device

A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and sup...

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Bibliographische Detailangaben
Hauptverfasser: Earmme, Tae Min, Lee, Kun Tack, Kim, Young Hoo, Cho, Seongkeun, Jang, Hun Jae, Shin, Seung Min, Jeang, Eun Hee
Format: Patent
Sprache:eng
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