Flux

Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass...

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Hauptverfasser:	Hagiwara, Takashi, Nishizaki, Takahiro, Kawasaki, Hiroyoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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creator	Hagiwara, Takashi Nishizaki, Takahiro Kawasaki, Hiroyoshi
description	Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11571772B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11571772B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11571772B23</originalsourceid><addsrcrecordid>eNrjZGBxyymt4GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoam5obm5kZORsbEqAEA4K4avA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Flux</title><source>esp@cenet</source><creator>Hagiwara, Takashi ; Nishizaki, Takahiro ; Kawasaki, Hiroyoshi</creator><creatorcontrib>Hagiwara, Takashi ; Nishizaki, Takahiro ; Kawasaki, Hiroyoshi</creatorcontrib><description>Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230207&DB=EPODOC&CC=US&NR=11571772B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230207&DB=EPODOC&CC=US&NR=11571772B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hagiwara, Takashi</creatorcontrib><creatorcontrib>Nishizaki, Takahiro</creatorcontrib><creatorcontrib>Kawasaki, Hiroyoshi</creatorcontrib><title>Flux</title><description>Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGBxyymt4GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoam5obm5kZORsbEqAEA4K4avA</recordid><startdate>20230207</startdate><enddate>20230207</enddate><creator>Hagiwara, Takashi</creator><creator>Nishizaki, Takahiro</creator><creator>Kawasaki, Hiroyoshi</creator><scope>EVB</scope></search><sort><creationdate>20230207</creationdate><title>Flux</title><author>Hagiwara, Takashi ; Nishizaki, Takahiro ; Kawasaki, Hiroyoshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11571772B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Hagiwara, Takashi</creatorcontrib><creatorcontrib>Nishizaki, Takahiro</creatorcontrib><creatorcontrib>Kawasaki, Hiroyoshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hagiwara, Takashi</au><au>Nishizaki, Takahiro</au><au>Kawasaki, Hiroyoshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flux</title><date>2023-02-07</date><risdate>2023</risdate><abstract>Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US11571772B2
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	Flux
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T04%3A49%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hagiwara,%20Takashi&rft.date=2023-02-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11571772B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true