Pressure features to alter the shape of a socket

Pressure features to alter the shape of a socket

Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mohammad, Feroz, Nekkanty, Srikant, Huettis, Alexander W, Tran, Donald Tiendung, Klein, Steven A, Shah, Hemant Mahesh, Aravamudhan, Srinivasa, Liu, Kuang
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Beschreibung
Zusammenfassung:Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.