Semiconductor packages and method of manufacturing semiconductor packages

A semiconductor package includes a redistribution wiring layer having redistribution wirings, a semiconductor chip on the redistribution wiring layer, a frame on the redistribution wiring layer, the frame surrounding the semiconductor chip, and the frame having core connection wirings electrically c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Yongkoon, Lee, Sangkyu, Kim, Jingu
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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