Method for manufacturing semiconductor structure

A method for manufacturing a semiconductor structure includes etching trenches in a semiconductor substrate to form a semiconductor fin between the trenches; converting sidewalls of the semiconductor fin into hydrogen-terminated surfaces each having silicon-to-hydrogen (S-H) bonds; after converting...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Wu, Cheng-Ta, Jangjian, Shiu-Ko, Chou, Chen-Cheng
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!