Systems and methods for bonding a downhole tool to a borehole tubular

The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The...

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Bibliographische Detailangaben
Hauptverfasser:	Acosta, Frank, Helms, Lonnie, Lewis, Sam, Pearl, Jr., William Cecil
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FIXED CONSTRUCTIONS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR MINING OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The methods may also include rupturing the shells of the solder particles to release the liquid metal cores. The methods may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.