Microelectronic package communication using radio interfaces connected through wiring

Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive conne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liff, Shawna, Elsherbini, Adel A, Oster, Sasha N, Chawla, Gaurav, Kamgaing, Telesphor
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE TELEPHONIC COMMUNICATION TRANSMISSION WAVEGUIDES
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