Light emitting package structure and method of manufacturing the same

Light emitting package structure and method of manufacturing the same

A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Liang, Kai-Chieh, Cheng, Wei-Te, Chiu, Kuo-Ming, Tsai, Jie-Ting
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Liang, Kai-Chieh
Cheng, Wei-Te
Chiu, Kuo-Ming
Tsai, Jie-Ting
description A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11522109B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11522109B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11522109B23</originalsourceid><addsrcrecordid>eNrjZHD1yUzPKFFIzc0sKcnMS1coSEzOTkxPVSguKSpNLiktSlVIzEtRyE0tychPUchPU8hNzCtNSwTJgFSXZABVJuam8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41GKgoal5qSXxocGGhqZGRoYGlk5GxsSoAQAEezNk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting package structure and method of manufacturing the same</title><source>esp@cenet</source><creator>Liang, Kai-Chieh ; Cheng, Wei-Te ; Chiu, Kuo-Ming ; Tsai, Jie-Ting</creator><creatorcontrib>Liang, Kai-Chieh ; Cheng, Wei-Te ; Chiu, Kuo-Ming ; Tsai, Jie-Ting</creatorcontrib><description>A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221206&amp;DB=EPODOC&amp;CC=US&amp;NR=11522109B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221206&amp;DB=EPODOC&amp;CC=US&amp;NR=11522109B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Liang, Kai-Chieh</creatorcontrib><creatorcontrib>Cheng, Wei-Te</creatorcontrib><creatorcontrib>Chiu, Kuo-Ming</creatorcontrib><creatorcontrib>Tsai, Jie-Ting</creatorcontrib><title>Light emitting package structure and method of manufacturing the same</title><description>A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1yUzPKFFIzc0sKcnMS1coSEzOTkxPVSguKSpNLiktSlVIzEtRyE0tychPUchPU8hNzCtNSwTJgFSXZABVJuam8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41GKgoal5qSXxocGGhqZGRoYGlk5GxsSoAQAEezNk</recordid><startdate>20221206</startdate><enddate>20221206</enddate><creator>Liang, Kai-Chieh</creator><creator>Cheng, Wei-Te</creator><creator>Chiu, Kuo-Ming</creator><creator>Tsai, Jie-Ting</creator><scope>EVB</scope></search><sort><creationdate>20221206</creationdate><title>Light emitting package structure and method of manufacturing the same</title><author>Liang, Kai-Chieh ; Cheng, Wei-Te ; Chiu, Kuo-Ming ; Tsai, Jie-Ting</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11522109B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Liang, Kai-Chieh</creatorcontrib><creatorcontrib>Cheng, Wei-Te</creatorcontrib><creatorcontrib>Chiu, Kuo-Ming</creatorcontrib><creatorcontrib>Tsai, Jie-Ting</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liang, Kai-Chieh</au><au>Cheng, Wei-Te</au><au>Chiu, Kuo-Ming</au><au>Tsai, Jie-Ting</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting package structure and method of manufacturing the same</title><date>2022-12-06</date><risdate>2022</risdate><abstract>A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11522109B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting package structure and method of manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T06%3A27%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Liang,%20Kai-Chieh&rft.date=2022-12-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11522109B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true