Systems and methods to determine and control temperature threshold for air-cooled expansion card devices

Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature lim...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Shabbir, Hasnain, Chen, Hui
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Shabbir, Hasnain Chen, Hui
description	Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11520389B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11520389B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11520389B23</originalsourceid><addsrcrecordid>eNqNjMEKwjAQBXvxIOo_rB9QsBZBr4rivXouIXklgTQbNqvo31vED_A0hxlmXvnuXRRjIZMcjVDPrpAyOShkDAlfYTmpcKSpzBCjDwGpFxTP0dHAQiZIbZkjHOGVTSqBE1kjbjo9g0VZVrPBxILVj4tqfTnfTtcamXuUbCwStL93TbPbbtr94bht_2k-T6VBAw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Systems and methods to determine and control temperature threshold for air-cooled expansion card devices</title><source>esp@cenet</source><creator>Shabbir, Hasnain ; Chen, Hui</creator><creatorcontrib>Shabbir, Hasnain ; Chen, Hui</creatorcontrib><description>Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221206&DB=EPODOC&CC=US&NR=11520389B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221206&DB=EPODOC&CC=US&NR=11520389B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Shabbir, Hasnain</creatorcontrib><creatorcontrib>Chen, Hui</creatorcontrib><title>Systems and methods to determine and control temperature threshold for air-cooled expansion card devices</title><description>Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjMEKwjAQBXvxIOo_rB9QsBZBr4rivXouIXklgTQbNqvo31vED_A0hxlmXvnuXRRjIZMcjVDPrpAyOShkDAlfYTmpcKSpzBCjDwGpFxTP0dHAQiZIbZkjHOGVTSqBE1kjbjo9g0VZVrPBxILVj4tqfTnfTtcamXuUbCwStL93TbPbbtr94bht_2k-T6VBAw</recordid><startdate>20221206</startdate><enddate>20221206</enddate><creator>Shabbir, Hasnain</creator><creator>Chen, Hui</creator><scope>EVB</scope></search><sort><creationdate>20221206</creationdate><title>Systems and methods to determine and control temperature threshold for air-cooled expansion card devices</title><author>Shabbir, Hasnain ; Chen, Hui</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11520389B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Shabbir, Hasnain</creatorcontrib><creatorcontrib>Chen, Hui</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shabbir, Hasnain</au><au>Chen, Hui</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Systems and methods to determine and control temperature threshold for air-cooled expansion card devices</title><date>2022-12-06</date><risdate>2022</risdate><abstract>Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US11520389B2
source	esp@cenet
subjects	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
title	Systems and methods to determine and control temperature threshold for air-cooled expansion card devices
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T06%3A27%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Shabbir,%20Hasnain&rft.date=2022-12-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11520389B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true