Testing device and method

Provided is a testing method including: disposing a wafer on a working platform of a testing device; and moving a circuit board of the testing device relative to the working platform by a movement assembly of the testing device so as to allow at least two testing ports of the circuit board to test t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Hsieh, Cheng-Tsai, Chen, Cheng-Shao, Hsiao, Po-Wen, Liang, Wen-Chin
Format: Patent
Sprache:eng
Schlagworte:
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