Lipseals and contact elements for semiconductor electroplating apparatuses

Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contac...

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Bibliographische Detailangaben

Hauptverfasser:	Stowell, Robert Marshall, Ramesh, Ashwin, Ghongadi, Shantinath, Feng, Jingbin
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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