Memory devices and methods of manufacturing the same
A memory device may include a substrate; a first stack structure comprising a plurality of first gate layers and a plurality of first interlayer insulating layers alternately stacked on the substrate; a second stack structure comprising a plurality of second gate layers and a plurality of second int...
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| creator | Kang, Kiyoon Cheon, Jisung |
| description | A memory device may include a substrate; a first stack structure comprising a plurality of first gate layers and a plurality of first interlayer insulating layers alternately stacked on the substrate; a second stack structure comprising a plurality of second gate layers and a plurality of second interlayer insulating layers alternately stacked on the first stack structure; and a channel structure penetrating the first stack structure and the second stack structure, wherein the channel structure comprises a first portion in a first channel hole penetrating the first stack structure, a second portion in a second channel hole penetrating the second stack structure, and a first protrusion located in a first recess recessed into one layer of the plurality of first interlayer insulating layers from a side portion of the first channel hole. |
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a second stack structure comprising a plurality of second gate layers and a plurality of second interlayer insulating layers alternately stacked on the first stack structure; and a channel structure penetrating the first stack structure and the second stack structure, wherein the channel structure comprises a first portion in a first channel hole penetrating the first stack structure, a second portion in a second channel hole penetrating the second stack structure, and a first protrusion located in a first recess recessed into one layer of the plurality of first interlayer insulating layers from a side portion of the first channel hole.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; PHYSICS ; SEMICONDUCTOR DEVICES ; STATIC STORES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=US&NR=11508744B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=US&NR=11508744B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kang, Kiyoon</creatorcontrib><creatorcontrib>Cheon, Jisung</creatorcontrib><title>Memory devices and methods of manufacturing the same</title><description>A memory device may include a substrate; a first stack structure comprising a plurality of first gate layers and a plurality of first interlayer insulating layers alternately stacked on the substrate; a second stack structure comprising a plurality of second gate layers and a plurality of second interlayer insulating layers alternately stacked on the first stack structure; and a channel structure penetrating the first stack structure and the second stack structure, wherein the channel structure comprises a first portion in a first channel hole penetrating the first stack structure, a second portion in a second channel hole penetrating the second stack structure, and a first protrusion located in a first recess recessed into one layer of the plurality of first interlayer insulating layers from a side portion of the first channel hole.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STATIC STORES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxTc3NL6pUSEkty0xOLVZIzEtRyE0tychPKVbIT1PITcwrTUtMLiktysxLVyjJSFUoTsxN5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoamBhbmJiZORsbEqAEAK_4s3g</recordid><startdate>20221122</startdate><enddate>20221122</enddate><creator>Kang, Kiyoon</creator><creator>Cheon, Jisung</creator><scope>EVB</scope></search><sort><creationdate>20221122</creationdate><title>Memory devices and methods of manufacturing the same</title><author>Kang, Kiyoon ; Cheon, Jisung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11508744B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INFORMATION STORAGE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STATIC STORES</topic><toplevel>online_resources</toplevel><creatorcontrib>Kang, Kiyoon</creatorcontrib><creatorcontrib>Cheon, Jisung</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kang, Kiyoon</au><au>Cheon, Jisung</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Memory devices and methods of manufacturing the same</title><date>2022-11-22</date><risdate>2022</risdate><abstract>A memory device may include a substrate; a first stack structure comprising a plurality of first gate layers and a plurality of first interlayer insulating layers alternately stacked on the substrate; a second stack structure comprising a plurality of second gate layers and a plurality of second interlayer insulating layers alternately stacked on the first stack structure; and a channel structure penetrating the first stack structure and the second stack structure, wherein the channel structure comprises a first portion in a first channel hole penetrating the first stack structure, a second portion in a second channel hole penetrating the second stack structure, and a first protrusion located in a first recess recessed into one layer of the plurality of first interlayer insulating layers from a side portion of the first channel hole.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES |
| title | Memory devices and methods of manufacturing the same |
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