Semiconductor package including substrate with outer insulating layer

A semiconductor package may include a substrate and a semiconductor chip on the substrate. The substrate may include an inner insulating layer, a redistribution layer in the inner insulating layer, an outer insulating layer on the inner insulating layer, a connection pad provided in the outer insula...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jeon, Gwangjae, Kim, Eungkyu, Kim, Jongyoun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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