Multi-layer solution based deposition of dielectrics for advanced substrate architectures
Embodiments include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a substrate, and a plurality of conductive features formed over the substrate. In an embodiment, a bilayer build-up layer is formed over the plurality of conduct...
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| creator | Brown, Andrew Park, Ji Yong Alur, Amruthavalli Xu, Cheng Alur, Siddharth |
| description | Embodiments include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a substrate, and a plurality of conductive features formed over the substrate. In an embodiment, a bilayer build-up layer is formed over the plurality of conductive features. In an embodiment, the bilayer build-up layer comprises a first dielectric layer and a second dielectric layer. In an embodiment, a surface of the first dielectric layer comprises depressions. In an embodiment, the second dielectric layer is disposed in the depressions of the surface of the first dielectric layer. |
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In an embodiment, the second dielectric layer is disposed in the depressions of the surface of the first dielectric layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=US&NR=11508636B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=US&NR=11508636B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Brown, Andrew</creatorcontrib><creatorcontrib>Park, Ji Yong</creatorcontrib><creatorcontrib>Alur, Amruthavalli</creatorcontrib><creatorcontrib>Xu, Cheng</creatorcontrib><creatorcontrib>Alur, Siddharth</creatorcontrib><title>Multi-layer solution based deposition of dielectrics for advanced substrate architectures</title><description>Embodiments include an electronic package and methods of forming an electronic package. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Multi-layer solution based deposition of dielectrics for advanced substrate architectures |
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