Redistribution layer metallic structure and method

The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Yen-Yu, Bih, Shih Wei, Lin, Chun-Chih, Lin, Chih-Wei, Cheng, Wen-Hao, Yeh, Sheng-Wei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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