Radio-frequency device with radio-frequency chip and waveguide structure
A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, w...
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creator | Minichshofer, Juergen Stelzer, Andreas Seler, Ernst Lampersberger, Thomas Feger, Reinhard Lang, Markus Josef |
description | A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11482771B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11482771B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11482771B23</originalsourceid><addsrcrecordid>eNrjZPAISkzJzNdNK0otLE3NS65USEkty0xOVSjPLMlQKEKTS87ILFBIzEtRKE8sS00vzUxJVSguKSpNLiktSuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGJhZG5uaGTkbGxKgBANqUNPI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Radio-frequency device with radio-frequency chip and waveguide structure</title><source>esp@cenet</source><creator>Minichshofer, Juergen ; Stelzer, Andreas ; Seler, Ernst ; Lampersberger, Thomas ; Feger, Reinhard ; Lang, Markus Josef</creator><creatorcontrib>Minichshofer, Juergen ; Stelzer, Andreas ; Seler, Ernst ; Lampersberger, Thomas ; Feger, Reinhard ; Lang, Markus Josef</creatorcontrib><description>A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRICITY</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221025&DB=EPODOC&CC=US&NR=11482771B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221025&DB=EPODOC&CC=US&NR=11482771B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Minichshofer, Juergen</creatorcontrib><creatorcontrib>Stelzer, Andreas</creatorcontrib><creatorcontrib>Seler, Ernst</creatorcontrib><creatorcontrib>Lampersberger, Thomas</creatorcontrib><creatorcontrib>Feger, Reinhard</creatorcontrib><creatorcontrib>Lang, Markus Josef</creatorcontrib><title>Radio-frequency device with radio-frequency chip and waveguide structure</title><description>A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAISkzJzNdNK0otLE3NS65USEkty0xOVSjPLMlQKEKTS87ILFBIzEtRKE8sS00vzUxJVSguKSpNLiktSuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGJhZG5uaGTkbGxKgBANqUNPI</recordid><startdate>20221025</startdate><enddate>20221025</enddate><creator>Minichshofer, Juergen</creator><creator>Stelzer, Andreas</creator><creator>Seler, Ernst</creator><creator>Lampersberger, Thomas</creator><creator>Feger, Reinhard</creator><creator>Lang, Markus Josef</creator><scope>EVB</scope></search><sort><creationdate>20221025</creationdate><title>Radio-frequency device with radio-frequency chip and waveguide structure</title><author>Minichshofer, Juergen ; Stelzer, Andreas ; Seler, Ernst ; Lampersberger, Thomas ; Feger, Reinhard ; Lang, Markus Josef</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11482771B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>Minichshofer, Juergen</creatorcontrib><creatorcontrib>Stelzer, Andreas</creatorcontrib><creatorcontrib>Seler, Ernst</creatorcontrib><creatorcontrib>Lampersberger, Thomas</creatorcontrib><creatorcontrib>Feger, Reinhard</creatorcontrib><creatorcontrib>Lang, Markus Josef</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Minichshofer, Juergen</au><au>Stelzer, Andreas</au><au>Seler, Ernst</au><au>Lampersberger, Thomas</au><au>Feger, Reinhard</au><au>Lang, Markus Josef</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Radio-frequency device with radio-frequency chip and waveguide structure</title><date>2022-10-25</date><risdate>2022</risdate><abstract>A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRICITY |
title | Radio-frequency device with radio-frequency chip and waveguide structure |
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