Method for fabricating electronic package structure
An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference...
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| creator | Tsai, Chi-Pin Chiu, Chih-Hsien Lin, Tsung-Li Shih, Chih-Yuan Lin, Chien-Cheng Chu, Heng-Cheng Chang, Yueh-Chiung Tsai, Tsung-Hsien Tsai, Ming-Fan |
| description | An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11476572B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11476572B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11476572B23</originalsourceid><addsrcrecordid>eNrjZDD2TS3JyE9RSMsvUkhLTCrKTE4sycxLV0jNSU0uKcrPy0xWKEhMzk5MT1UoLikqTS4pLUrlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUD1qXmpJfGhwYaGJuZmpuZGTkbGxKgBACHpLPc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for fabricating electronic package structure</title><source>esp@cenet</source><creator>Tsai, Chi-Pin ; Chiu, Chih-Hsien ; Lin, Tsung-Li ; Shih, Chih-Yuan ; Lin, Chien-Cheng ; Chu, Heng-Cheng ; Chang, Yueh-Chiung ; Tsai, Tsung-Hsien ; Tsai, Ming-Fan</creator><creatorcontrib>Tsai, Chi-Pin ; Chiu, Chih-Hsien ; Lin, Tsung-Li ; Shih, Chih-Yuan ; Lin, Chien-Cheng ; Chu, Heng-Cheng ; Chang, Yueh-Chiung ; Tsai, Tsung-Hsien ; Tsai, Ming-Fan</creatorcontrib><description>An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221018&DB=EPODOC&CC=US&NR=11476572B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221018&DB=EPODOC&CC=US&NR=11476572B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tsai, Chi-Pin</creatorcontrib><creatorcontrib>Chiu, Chih-Hsien</creatorcontrib><creatorcontrib>Lin, Tsung-Li</creatorcontrib><creatorcontrib>Shih, Chih-Yuan</creatorcontrib><creatorcontrib>Lin, Chien-Cheng</creatorcontrib><creatorcontrib>Chu, Heng-Cheng</creatorcontrib><creatorcontrib>Chang, Yueh-Chiung</creatorcontrib><creatorcontrib>Tsai, Tsung-Hsien</creatorcontrib><creatorcontrib>Tsai, Ming-Fan</creatorcontrib><title>Method for fabricating electronic package structure</title><description>An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2TS3JyE9RSMsvUkhLTCrKTE4sycxLV0jNSU0uKcrPy0xWKEhMzk5MT1UoLikqTS4pLUrlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUD1qXmpJfGhwYaGJuZmpuZGTkbGxKgBACHpLPc</recordid><startdate>20221018</startdate><enddate>20221018</enddate><creator>Tsai, Chi-Pin</creator><creator>Chiu, Chih-Hsien</creator><creator>Lin, Tsung-Li</creator><creator>Shih, Chih-Yuan</creator><creator>Lin, Chien-Cheng</creator><creator>Chu, Heng-Cheng</creator><creator>Chang, Yueh-Chiung</creator><creator>Tsai, Tsung-Hsien</creator><creator>Tsai, Ming-Fan</creator><scope>EVB</scope></search><sort><creationdate>20221018</creationdate><title>Method for fabricating electronic package structure</title><author>Tsai, Chi-Pin ; Chiu, Chih-Hsien ; Lin, Tsung-Li ; Shih, Chih-Yuan ; Lin, Chien-Cheng ; Chu, Heng-Cheng ; Chang, Yueh-Chiung ; Tsai, Tsung-Hsien ; Tsai, Ming-Fan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11476572B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Tsai, Chi-Pin</creatorcontrib><creatorcontrib>Chiu, Chih-Hsien</creatorcontrib><creatorcontrib>Lin, Tsung-Li</creatorcontrib><creatorcontrib>Shih, Chih-Yuan</creatorcontrib><creatorcontrib>Lin, Chien-Cheng</creatorcontrib><creatorcontrib>Chu, Heng-Cheng</creatorcontrib><creatorcontrib>Chang, Yueh-Chiung</creatorcontrib><creatorcontrib>Tsai, Tsung-Hsien</creatorcontrib><creatorcontrib>Tsai, Ming-Fan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tsai, Chi-Pin</au><au>Chiu, Chih-Hsien</au><au>Lin, Tsung-Li</au><au>Shih, Chih-Yuan</au><au>Lin, Chien-Cheng</au><au>Chu, Heng-Cheng</au><au>Chang, Yueh-Chiung</au><au>Tsai, Tsung-Hsien</au><au>Tsai, Ming-Fan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for fabricating electronic package structure</title><date>2022-10-18</date><risdate>2022</risdate><abstract>An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Method for fabricating electronic package structure |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T22%3A59%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Tsai,%20Chi-Pin&rft.date=2022-10-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11476572B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |