Inverter

A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin conn...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Campbell, Colin Kenneth, Sasaridis, Dino, Liu, Wenjun, Ramm, Robert James, Tepe, Alan David
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.