Dielectric film, dielectric element, and electronic circuit board

A dielectric film may be exposed to an acid solution such as hydrochloric acid, nitric acid, or sulfuric acid during a wet process after film formation. The inventors have newly found that when a dielectric film includes Zr having a lower ionization tendency than Ti in a main component of a metal ox...

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Bibliographische Detailangaben
Hauptverfasser: Saita, Hitoshi, Furukawa, Masahito, Uchiyama, Hiroki, Sato, Wakiko, Haemori, Masamitsu, Takahashi, Saori
Format: Patent
Sprache:eng
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