Localized rework using liquid media soldering
Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system m...
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| creator | Bielick, James D Lewis, Theron Lee Hugo, Stephen Michael Bennett, Jennifer I Dangler, John R Braun, David J Younger, Timothy P Jennings, Timothy |
| description | Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11445650B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11445650B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11445650B23</originalsourceid><addsrcrecordid>eNrjZND1yU9OzMmsSk1RKEotzy_KVigtzsxLV8jJLCzNTFHITU3JTFQozs9JSS0CCvMwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYENDExNTM1MDJyNjYtQAAOGaKoI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Localized rework using liquid media soldering</title><source>esp@cenet</source><creator>Bielick, James D ; Lewis, Theron Lee ; Hugo, Stephen Michael ; Bennett, Jennifer I ; Dangler, John R ; Braun, David J ; Younger, Timothy P ; Jennings, Timothy</creator><creatorcontrib>Bielick, James D ; Lewis, Theron Lee ; Hugo, Stephen Michael ; Bennett, Jennifer I ; Dangler, John R ; Braun, David J ; Younger, Timothy P ; Jennings, Timothy</creatorcontrib><description>Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220913&DB=EPODOC&CC=US&NR=11445650B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220913&DB=EPODOC&CC=US&NR=11445650B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bielick, James D</creatorcontrib><creatorcontrib>Lewis, Theron Lee</creatorcontrib><creatorcontrib>Hugo, Stephen Michael</creatorcontrib><creatorcontrib>Bennett, Jennifer I</creatorcontrib><creatorcontrib>Dangler, John R</creatorcontrib><creatorcontrib>Braun, David J</creatorcontrib><creatorcontrib>Younger, Timothy P</creatorcontrib><creatorcontrib>Jennings, Timothy</creatorcontrib><title>Localized rework using liquid media soldering</title><description>Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1yU9OzMmsSk1RKEotzy_KVigtzsxLV8jJLCzNTFHITU3JTFQozs9JSS0CCvMwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYENDExNTM1MDJyNjYtQAAOGaKoI</recordid><startdate>20220913</startdate><enddate>20220913</enddate><creator>Bielick, James D</creator><creator>Lewis, Theron Lee</creator><creator>Hugo, Stephen Michael</creator><creator>Bennett, Jennifer I</creator><creator>Dangler, John R</creator><creator>Braun, David J</creator><creator>Younger, Timothy P</creator><creator>Jennings, Timothy</creator><scope>EVB</scope></search><sort><creationdate>20220913</creationdate><title>Localized rework using liquid media soldering</title><author>Bielick, James D ; Lewis, Theron Lee ; Hugo, Stephen Michael ; Bennett, Jennifer I ; Dangler, John R ; Braun, David J ; Younger, Timothy P ; Jennings, Timothy</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11445650B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Bielick, James D</creatorcontrib><creatorcontrib>Lewis, Theron Lee</creatorcontrib><creatorcontrib>Hugo, Stephen Michael</creatorcontrib><creatorcontrib>Bennett, Jennifer I</creatorcontrib><creatorcontrib>Dangler, John R</creatorcontrib><creatorcontrib>Braun, David J</creatorcontrib><creatorcontrib>Younger, Timothy P</creatorcontrib><creatorcontrib>Jennings, Timothy</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bielick, James D</au><au>Lewis, Theron Lee</au><au>Hugo, Stephen Michael</au><au>Bennett, Jennifer I</au><au>Dangler, John R</au><au>Braun, David J</au><au>Younger, Timothy P</au><au>Jennings, Timothy</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Localized rework using liquid media soldering</title><date>2022-09-13</date><risdate>2022</risdate><abstract>Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Localized rework using liquid media soldering |
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