Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame

Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame

An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second l...

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Hauptverfasser: Nakanishi, Tsukasa, Hatori, Yukinori, Inoue, Akinobu, Araki, Yasushi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Nakanishi, Tsukasa
Hatori, Yukinori
Inoue, Akinobu
Araki, Yasushi
description An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame
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