Conductive film and manufacturing method thereof

Disclosed is an electrically-conductive film, comprising a support layer, an electrically-conductive area, a lead, and a bridging part. The support layer comprises a first side and a second side in an opposite arrangement. The support layer is recessively provided with a first groove and a second groove not in communication with each other. The first groove is filled with an electrically-conductive material to form an electrically-conductive area. The second groove is filled with an electrically-conductive material to form a lead. The bridging part is provided on the first side; the bridging part is electrically connected to the electrically-conductive area and to the lead. With the bridging part connected to the electrically-conductive area and to the lead, the connection is of increased reliability, and the electrical conductivity is increased. In addition, also disclosed is a preparation method for the electrically-conductive film.