Integrated circuit device and method of manufacturing the same

An integrated circuit device includes a plurality of semiconductor layers stacked on a substrate to overlap each other in a vertical direction and longitudinally extending along a first horizontal direction. The plurality of semiconductor layers may have different thicknesses in the vertical directi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Son, Yonghoon, Song, Hyunji, Park, Kwangho, Kim, Jaehoon, Jung, Seungjae, Lee, Gyeonghee
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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