Wiring substrate and semiconductor device

A wiring substrate of the present disclosure includes a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The substrate has an insulating surface. The first conductive layer is disposed on the substrate and includes a first part and a second part. The firs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Takano, Takamasa, Sagara, Shuji, Yoshii, Yumi, Aritsuka, Yuki, Suzuki, Miyuki, Tanaka, Masaya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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