Memory device including circuitry under bond pads
Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outsid...
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| creator | Marr, Kenneth William Tomayer, Joshua Daniel Violette, Michael P Davis, James E Cerafogli, Chiara Soderling, Brian J |
| description | Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate. |
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Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; PHYSICS ; PULSE TECHNIQUE ; SEMICONDUCTOR DEVICES ; STATIC STORES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220823&DB=EPODOC&CC=US&NR=11424169B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220823&DB=EPODOC&CC=US&NR=11424169B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Marr, Kenneth William</creatorcontrib><creatorcontrib>Tomayer, Joshua Daniel</creatorcontrib><creatorcontrib>Violette, Michael P</creatorcontrib><creatorcontrib>Davis, James E</creatorcontrib><creatorcontrib>Cerafogli, Chiara</creatorcontrib><creatorcontrib>Soderling, Brian J</creatorcontrib><title>Memory device including circuitry under bond pads</title><description>Some embodiments include apparatuses and methods of fabricating the apparatuses. 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One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS PULSE TECHNIQUE SEMICONDUCTOR DEVICES STATIC STORES |
| title | Memory device including circuitry under bond pads |
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