Component carrier and method of manufacturing the same

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping struct...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liebfahrt, Sabine, Frewein, Markus, Lutschounig, Ferdinand, Reitmaier, Bernhard, Platzer, Julia
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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