Semiconductor package having partial outer metal layer and packaging method thereof
A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation...
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| creator | Hsu, Kun-Chi Chen, Ying-Lin Chen, Shih-Chun Wu, Ting-Yeh Tseng, Sheng-Tou Wu, Chin-Ta |
| description | A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step. |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor package having partial outer metal layer and packaging method thereof |
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