Power driving chip and method thereof

A power driving chip and method are disclosed. The power driving chip includes an integrated power module disposed in a package structure and including a transistor and a gate driver electrically connected to the transistor; a controller disposed in the package structure and electrically connected to the integrated power module; and a multi-level over-temperature protection circuit for measuring an inner temperature of the integrated power module. When the inner temperature exceeds a first trigger temperature, the multi-level over-temperature protection circuit triggers the controller to reduce the output power of the integrated power module. When the inner temperature exceeds a second trigger temperature, the multi-level overheating protection circuit triggers the controller to turn off the integrated power module. The second trigger temperature is higher than the first trigger temperature.