Stacked microfeature devices and associated methods

Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Johnson, Mark S, Heng, Mung Suan, Leong, Vince Chan Seng, Tan, Kok Chua
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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