Circuit board, method of manufacturing circuit board, and electronic device
A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second sur...
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creator | Furuyama, Masaharu Koide, Masateru Mizutani, Daisuke Akahoshi, Tomoyuki Watanabe, Manabu Yamawaki, Seigo Fukui, Kei |
description | A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11317520B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11317520B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11317520B23</originalsourceid><addsrcrecordid>eNrjZPB2zixKLs0sUUjKTyxK0VHITS3JyE9RyE9TyE3MK01LTC4pLcrMS1dIRlWWmJeikJqTmlxSlJ-XmayQklqWmZzKw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkviQ4MNDY0NzU2NDJyMjIlRAwAy8DUx</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board, method of manufacturing circuit board, and electronic device</title><source>esp@cenet</source><creator>Furuyama, Masaharu ; Koide, Masateru ; Mizutani, Daisuke ; Akahoshi, Tomoyuki ; Watanabe, Manabu ; Yamawaki, Seigo ; Fukui, Kei</creator><creatorcontrib>Furuyama, Masaharu ; Koide, Masateru ; Mizutani, Daisuke ; Akahoshi, Tomoyuki ; Watanabe, Manabu ; Yamawaki, Seigo ; Fukui, Kei</creatorcontrib><description>A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220426&DB=EPODOC&CC=US&NR=11317520B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220426&DB=EPODOC&CC=US&NR=11317520B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Furuyama, Masaharu</creatorcontrib><creatorcontrib>Koide, Masateru</creatorcontrib><creatorcontrib>Mizutani, Daisuke</creatorcontrib><creatorcontrib>Akahoshi, Tomoyuki</creatorcontrib><creatorcontrib>Watanabe, Manabu</creatorcontrib><creatorcontrib>Yamawaki, Seigo</creatorcontrib><creatorcontrib>Fukui, Kei</creatorcontrib><title>Circuit board, method of manufacturing circuit board, and electronic device</title><description>A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB2zixKLs0sUUjKTyxK0VHITS3JyE9RyE9TyE3MK01LTC4pLcrMS1dIRlWWmJeikJqTmlxSlJ-XmayQklqWmZzKw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkviQ4MNDY0NzU2NDJyMjIlRAwAy8DUx</recordid><startdate>20220426</startdate><enddate>20220426</enddate><creator>Furuyama, Masaharu</creator><creator>Koide, Masateru</creator><creator>Mizutani, Daisuke</creator><creator>Akahoshi, Tomoyuki</creator><creator>Watanabe, Manabu</creator><creator>Yamawaki, Seigo</creator><creator>Fukui, Kei</creator><scope>EVB</scope></search><sort><creationdate>20220426</creationdate><title>Circuit board, method of manufacturing circuit board, and electronic device</title><author>Furuyama, Masaharu ; Koide, Masateru ; Mizutani, Daisuke ; Akahoshi, Tomoyuki ; Watanabe, Manabu ; Yamawaki, Seigo ; Fukui, Kei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11317520B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Furuyama, Masaharu</creatorcontrib><creatorcontrib>Koide, Masateru</creatorcontrib><creatorcontrib>Mizutani, Daisuke</creatorcontrib><creatorcontrib>Akahoshi, Tomoyuki</creatorcontrib><creatorcontrib>Watanabe, Manabu</creatorcontrib><creatorcontrib>Yamawaki, Seigo</creatorcontrib><creatorcontrib>Fukui, Kei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Furuyama, Masaharu</au><au>Koide, Masateru</au><au>Mizutani, Daisuke</au><au>Akahoshi, Tomoyuki</au><au>Watanabe, Manabu</au><au>Yamawaki, Seigo</au><au>Fukui, Kei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board, method of manufacturing circuit board, and electronic device</title><date>2022-04-26</date><risdate>2022</risdate><abstract>A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Circuit board, method of manufacturing circuit board, and electronic device |
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