Thermal radiation body for cooling heating element and method for manufacturing the same

Thermal radiation body for cooling heating element and method for manufacturing the same

The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat r...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kim, Sun Kyung, Cho, Jin Woo, Bae, Duk Kyu, Kim, Sung Hee, Kim, Ka Youn
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Kim, Sun Kyung
Cho, Jin Woo
Bae, Duk Kyu
Kim, Sung Hee
Kim, Ka Youn
description The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11316059B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11316059B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11316059B23</originalsourceid><addsrcrecordid>eNqNyrEKwjAURuEsDqK-w_UBBGNRcFUUdyu4lWvyxxSS3JKmg29vFR_A6Qznm6p77ZEjB8psWy6tJHqIfZGTTEYktOlJHuMYi4CIVIiTpYjixX5Z5DQ4NmXIH1Q8qOeIuZo4Dj0Wv87U8nyqj5cVOmnQd2yQUJrbVetK79bb_WFT_WPepHw6bw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermal radiation body for cooling heating element and method for manufacturing the same</title><source>esp@cenet</source><creator>Kim, Sun Kyung ; Cho, Jin Woo ; Bae, Duk Kyu ; Kim, Sung Hee ; Kim, Ka Youn</creator><creatorcontrib>Kim, Sun Kyung ; Cho, Jin Woo ; Bae, Duk Kyu ; Kim, Sung Hee ; Kim, Ka Youn</creatorcontrib><description>The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220426&amp;DB=EPODOC&amp;CC=US&amp;NR=11316059B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220426&amp;DB=EPODOC&amp;CC=US&amp;NR=11316059B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Sun Kyung</creatorcontrib><creatorcontrib>Cho, Jin Woo</creatorcontrib><creatorcontrib>Bae, Duk Kyu</creatorcontrib><creatorcontrib>Kim, Sung Hee</creatorcontrib><creatorcontrib>Kim, Ka Youn</creatorcontrib><title>Thermal radiation body for cooling heating element and method for manufacturing the same</title><description>The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAURuEsDqK-w_UBBGNRcFUUdyu4lWvyxxSS3JKmg29vFR_A6Qznm6p77ZEjB8psWy6tJHqIfZGTTEYktOlJHuMYi4CIVIiTpYjixX5Z5DQ4NmXIH1Q8qOeIuZo4Dj0Wv87U8nyqj5cVOmnQd2yQUJrbVetK79bb_WFT_WPepHw6bw</recordid><startdate>20220426</startdate><enddate>20220426</enddate><creator>Kim, Sun Kyung</creator><creator>Cho, Jin Woo</creator><creator>Bae, Duk Kyu</creator><creator>Kim, Sung Hee</creator><creator>Kim, Ka Youn</creator><scope>EVB</scope></search><sort><creationdate>20220426</creationdate><title>Thermal radiation body for cooling heating element and method for manufacturing the same</title><author>Kim, Sun Kyung ; Cho, Jin Woo ; Bae, Duk Kyu ; Kim, Sung Hee ; Kim, Ka Youn</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11316059B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Sun Kyung</creatorcontrib><creatorcontrib>Cho, Jin Woo</creatorcontrib><creatorcontrib>Bae, Duk Kyu</creatorcontrib><creatorcontrib>Kim, Sung Hee</creatorcontrib><creatorcontrib>Kim, Ka Youn</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Sun Kyung</au><au>Cho, Jin Woo</au><au>Bae, Duk Kyu</au><au>Kim, Sung Hee</au><au>Kim, Ka Youn</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermal radiation body for cooling heating element and method for manufacturing the same</title><date>2022-04-26</date><risdate>2022</risdate><abstract>The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11316059B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Thermal radiation body for cooling heating element and method for manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T00%3A03%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim,%20Sun%20Kyung&rft.date=2022-04-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11316059B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true