Leadframe with sockets for solderless pins

Leadframe with sockets for solderless pins

In a general aspect, a method can include coupling a semiconductor component to a leadframe. The leadframe can include a socket member having a first end portion and a second end portion. The socket member can further include an opening disposed between the first end portion and the second end porti...

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Hauptverfasser: Lee, Keunhyuk, Maldo, Tiburcio
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
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creator Lee, Keunhyuk
Maldo, Tiburcio
description In a general aspect, a method can include coupling a semiconductor component to a leadframe. The leadframe can include a socket member having a first end portion and a second end portion. The socket member can further include an opening disposed between the first end portion and the second end portion. The opening of the socket member can be configured to receive a solderless pin. The method can also include encapsulating, in a molding compound, at least a portion of the leadframe and at least a portion of the semiconductor component such that the opening of the socket member is exposed through the molding compound.
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subjects BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
title Leadframe with sockets for solderless pins
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