Semiconductor component, and contacting assembly having a semiconductor component and a printed circuit board

The invention relates to a semiconductor component (2), comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of planar connection points (12), which are arranged on a bottom side of the housing (5) and can be electrically connec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Vollmer, Lars, Kosbi, Klaus, Lausmann, Matthias, Gera, Guenter
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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