Semiconductor device and method of forming SIP module over film layer

A semiconductor device has a semiconductor die or component, including an IPD, disposed over an attach area of a penetrable film layer with a portion of the semiconductor die or component embedded in the penetrable film layer. A conductive layer is formed over a portion of the film layer within the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yoon, InSang, Kim, OhHan, Beak, WoonJae, Lee, HunTeak, Kim, KyungHwan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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