Virtualized link states of multiple protocol layer package interconnects

Systems, methods, and devices can include a first die comprising a first arbitration and multiplexing logic, a first protocol stack associated with a first interconnect protocol, and a second protocol stack associated with a second interconnect protocol. A second die comprising a second arbitration...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lim, Su Wei, Hor, Joon Teik, Song, Ting Lok, Wagh, Mahesh
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!