Three-dimensional memory device with via structures surrounded by perforated dielectric moat structure and methods of making the same

A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory stack structures vertically extending through the alternating stack, a perforated dielectric moat structure vertically extending through the altern...

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Bibliographische Detailangaben
Hauptverfasser: Otsu, Yoshitaka, Kanazawa, Junpei, Terahara, Masanori
Format: Patent
Sprache:eng
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